R3D: Resistive 3D Extraction and Analysis
Improves design efficiency and reliability.
R3D-DDM: Transient Analysis of Power Devices
More accurate simulation of device and surrounding circuitry.
R3D Gate: Parasitic Extraction and Analysis
Quickly identify and correct gate network problems, faster time to signoff with higher reliability.
Ethan: 3D Electro-Thermal Simulation
Improves reliability by highlighting thermal weaknesses, optimizes thermal and current sensor locations.
P2P-RMAP: Resistance Mapping and Analysis
Quickly highlight the source of power network problems.
P2P-XL: Full-chip IR-Drop and EM Analysis
Verify EM/IR-Drop throughout the physical design flow.
ESRA: Full-chip Transient ESD Analysis
Verifies protection against HBM/CDM ESD events for improved design reliability.