Improves design efficiency and reliability.
More accurate simulation of device and surrounding circuitry.
Quickly identify and correct gate network problems, faster time to signoff with higher reliability.
Improves reliability by highlighting thermal weaknesses, optimizes thermal and current sensor locations.
Quickly highlight the source of power network problems.
Verify EM/IR-Drop throughout the physical design flow.
Verifies protection against HBM/CDM ESD events for improved design reliability.